专利名称：Redistributed chip packaging with thermal
contact to device backside
发明人：Neil T. Tracht,Darrel R Frear,James R.
Griffiths,Lizabeth Ann A. Keser,Tien Yu T.Lee,Elie A. Maalouf
申请号：US11831651申请日：20070731公开号：US08217511B2公开日：20120710
专利附图：
摘要：An integrated circuit assembly includes a panel including an semiconductor
device at least partially surrounded by an encapsulant. A panel upper surface and adevice active surface are substantially coplanar. The assembly further includes one ormore interconnect layers overlying the panel upper surface. Each of the interconnectlayers includes an insulating film having contacts formed therein an interconnect
metallization formed thereon. A lower surface of the panel is substantially coplanar witheither a backside of the device or a lower surface of a thermally and electricallyconductive slab that has an upper surface in thermal contact with the device backside.The assembly may also include a set of panel vias. The panel vias are thermally andelectrically conductive conduits extending through the panel between the interconnectlayer and suitable for bonding with a land grid array (LGA) or other contact structure ofan underlying circuit board.
申请人：Neil T. Tracht,Darrel R Frear,James R. Griffiths,Lizabeth Ann A. Keser,Tien Yu T.Lee,Elie A. Maalouf
地址：Mesa AZ US,Phoenix AZ US,Chandler AZ US,Chandler AZ US,Phoenix AZ US,MesaAZ US
国籍：US,US,US,US,US,US
代理机构：Jackson Walker L.L.P.
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