Electronic package and method of forming

专利名称：Electronic package and method of forming发明人：David V. Caletka,Eric A. Johnson申请号：US09430075申请日：19991029公开号：US06507116B1公开日：20030114

专利附图：

摘要：An electronic package and method of making same in which a thermallyconductive member is in thermally conductive communication with a semiconductor chipencapsulated within a dielectric material that surrounds portions of a thermallyconductive member, semiconductor chip, and a predefined portion of a circuitized

substrate. The present invention's thermally conductive member includes two portionsof different bending stiffness to assure reduced interfacial stresses between thesemiconductor chip and the circuitized substrate.

申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION

代理人：Laurence R. Fraley,Steven Fischman

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