Method for producing an electrical contact for an

专利名称：Method for producing an electrical contact

for an optoelectronic semiconductor chip

发明人：Wilhelm Stein,Michael Fehrer,Johannes

Baur,Matthias Winter,Andreas

Ploessl,Stephan Kaiser,Berthold Hahn,FranzEberhard

申请号：US11654224申请日：20070116公开号：US07696078B2公开日：20100413

专利附图：

摘要：A method for producing an electrical contact of an optoelectronic

semiconductor chip (), comprising providing a mirror layer (), comprised of a metal ormetal alloy, over the semiconductor chip; providing a protective layer () over said mirrorlayer; providing a layer sequence of a barrier layer and a coupling layer () over saidprotective layer; and providing a solder layer () over said layer sequence.

申请人：Wilhelm Stein,Michael Fehrer,Johannes Baur,Matthias Winter,Andreas

Ploessl,Stephan Kaiser,Berthold Hahn,Franz Eberhard

地址：Liudau DE,Bad Abbach DE,Laaber DE,Regensburg DE,RegensburgDE,Regensburg DE,Hemau DE,Regensburg DE

国籍：DE,DE,DE,DE,DE,DE,DE,DE

代理机构：Cohen Pontant Lieberman & Pavane LLP

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