SMPS MOSFET
Applications
lHigh Frequency DC-DC Isolated
Converters with Synchronous Rectification for Telecom and Industrial useHigh Frequency Buck Converters for Computer Processor Power
l
IRF3707IRF3707SIRF3707L
HEXFET® Power MOSFET
VDSS
30V
RDS(on) max
12.5mΩ
ID
62A
Benefits
lll
Ultra-Low Gate ImpedanceVery Low RDS(on)
TO-220ABIRF3707
D2PakIRF3707S
TO-262IRF3707L
Fully Characterized Avalanche Voltage and Current
Absolute Maximum Ratings
Symbol
Parameter
Max.
Units
VDSDrain-Source Voltage 30VVGS Gate-to-Source Voltage ± 20 VID @ TC = 25°CContinuous Drain Current, VGS @ 10V 62ID @ TC = 70°CContinuous Drain Current, VGS @ 10V 52AIDMPulsed Drain Current248PD @TC = 25°CMaximum Power Dissipation 87WPD @TC = 70°CMaximum Power Dissipation 61W Linear Derating Factor 0.59 mW/°CTJ , TSTGJunction and Storage Temperature Range-55 to + 175°C
Thermal Resistance
Parameter
RθJCRθCSRθJARθJA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface Junction-to-Ambient
Junction-to-Ambient (PCB mount)*
Typ.
–––0.50––––––
Max.
1.73–––6240
Units
°C/W
* When mounted on 1\" square PCB (FR-4 or G-10 Material) .
For recommended footprint and soldering techniques refer to application note #AN-994
Notes through are on page 10
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8/22/00
IRF3707/3707S/3707L
Static @ TJ = 25°C (unless otherwise specified)
ParameterMin.Typ.Max.Units ConditionsV(BR)DSSDrain-to-Source Breakdown Voltage30––––––VVGS = 0V, ID = 250µA∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.027 ––– V/°C Reference to 25°C, ID = 1mA–––9.0 12.5VGS = 10V, ID = 15A RDS(on)Static Drain-to-Source On-ResistancemΩ–––12.617VGS = 4.5V, ID = 12A VGS(th)Gate Threshold Voltage1.0–––3.0VVDS = VGS, ID = 250µA––––––20VDS = 24V, VGS = 0VµAIDSSDrain-to-Source Leakage Current––––––100VDS = 24V, VGS = 0V, TJ = 125°CGate-to-Source Forward Leakage––––––200VGS = 16VIGSSnAGate-to-Source Reverse Leakage––––––-200VGS = -16VDynamic @ TJ = 25°C (unless otherwise specified)SymbolgfsQgQgsQgdQosstd(on)trtd(off)tfCissCossCrssParameterForward TransconductanceTotal Gate ChargeGate-to-Source ChargeGate-to-Drain (\"Miller\") ChargeOutput Gate ChargeTurn-On Delay TimeRise TimeTurn-Off Delay TimeFall TimeInput CapacitanceOutput CapacitanceReverse Transfer CapacitanceMin.37–––––––––––––––––––––––––––––––––Typ.–––198.26.3188.57811.83.3199070750Max.Units Conditions–––SVDS = 15V, ID = 49.6A––– ID = 24.8A–––nCVDS = 15V–––VGS = 4.5V 27VGS = 0V, VDS = 15V–––VDD = 15V–––ID = 24.8Ans–––RG = 1.8Ω–––VGS = 4.5V –––VGS = 0V–––VDS = 15V–––pFƒ = 1.0MHzAvalanche CharacteristicsSymbolEASIARParameterSingle Pulse Avalanche EnergyAvalanche CurrentTyp.––––––Max.21362UnitsmJADiode CharacteristicsSymbolISISMParameterContinuous Source Current(Body Diode)Pulsed Source Current(Body Diode) Diode Forward VoltageReverse Recovery TimeReverse Recovery ChargeReverse Recovery TimeReverse Recovery ChargeMin.Typ.Max.Units––––––––––––––––––––––––––––––0.880.83949426262A2481.3–––59746393VnsnCnsnCVSDtrrQrrtrrQrr ConditionsDMOSFET symbolshowing theGintegral reverseSp-n junction diode.TJ = 25°C, IS = 31A, VGS = 0V TJ = 125°C, IS = 31A, VGS = 0V TJ = 25°C, IF = 31A, VR=20Vdi/dt = 100A/µs TJ = 125°C, IF = 31A, VR=20Vdi/dt = 100A/µs 2www.irf.com
IRF3707/3707S/3707L
1000
VGS TOP 10.0V 9.0V 8.0V 7.0V 6.0V 5.0V 4.5VBOTTOM 3.5V1000
VGS TOP 10.0V 9.0V 8.0V 7.0V 6.0V 5.0V 4.5VBOTTOM 3.5V100
ID, Drain-to-Source Current (A)ID, Drain-to-Source Current (A)100
3.5V10
3.5V10
20µs PULSE WIDTHTj = 25°C10.1
1
10
100
20µs PULSE WIDTHTj = 175°C10.1
1
10
100
VDS, Drain-to-Source Voltage (V)
VDS, Drain-to-Source Voltage (V)
Fig 1. Typical Output CharacteristicsFig 2. Typical Output Characteristics
10002.5°T = 25 CJR S ( o n D) , Drain-to-Source On Resistance(Normalized)ID=62AI D , Drain-to-Source Current (A)2.0 100°T = 175 CJ1.51.00.5 103.0V = 15VDS20µs PULSE WIDTH6.07.04.05.08.00.0-60-40-20VGS=10V020406080100120140160180V , Gate-to-Source Voltage (V)GS°T , Junction Temperature( C)JFig 3. Typical Transfer CharacteristicsFig 4. Normalized On-ResistanceVs. Temperature
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IRF3707/3707S/3707L
3000VCGS=0V,Cf = 1MHziss=gs+ Cgd ,C SHORTED2500C=CdsCrssgdoss=Cds+ Cgd)FC(p2000iss centaic1500pa CaC,C1000oss500Crss0 1 10 100V , Drain-to-Source Voltage (V)DSFig 5. Typical Capacitance Vs.
Drain-to-Source Voltage 1000)A( tn 100rerTJ = 175 C°Cu inraD 10 serT = 25 CJ°veRe , D 1 SI0.1V = 0 V GS0.20.61.01.41.8V ,Source-to-Drain Voltage (V)SDFig 7. Typical Source-Drain DiodeForward Voltage
410ID=24.8AVDS= 15V)V( 8getalVo 6ceruSo-to-4teGa , S G2V0010203040Q , Total Gate Charge (nC)GFig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
1000OPERATION IN THIS AREA LIMITEDBY RDS(on)10usA) (t 100nerur100usC niaDr , 101ms DI10ms T TC= 25 C° 1°Single PulseJ= 175 C 1 10 100V , Drain-to-Source Voltage (V)DSFig 8. Maximum Safe Operating Area
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IRF3707/3707S/3707L
7060VDSVGSRGRDD.U.T.+I , Drain Current (A)D50-VDD
10V4030Pulse Width ≤ 1 µsDuty Factor ≤ 0.1 %Fig 10a. Switching Time Test Circuit
20VDS10090%255075100125150175°T , Case Temperature( C)C10%VGStd(on)trtd(off)tfFig 9. Maximum Drain Current Vs.Case Temperature
Fig 10b. Switching Time Waveforms
10Thermal Response(Z t h J )C 1D = 0.500.200.100.050.10.020.01SINGLE PULSE(THERMAL RESPONSE)0.010.00001Notes:1. Duty factor D =t / t122. Peak TJ=PDMx ZthJC+ TC0.10.00010.0010.01 1PDMt1t2t , Rectangular Pulse Duration (sec)1Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
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IRF3707/3707S/3707L
RDS ( on ) , Drain-to-Source On Resistance ( Ω )0.090.080.070.060.050.040.030.020.010.00
0
50
100
150
200
250
ID , Drain Current ( A )
VGS = 10VVGS = 4.5VRDS(on), Drain-to -Source On Resistance (Ω)0.100.0130.0120.011ID = 31A0.0100.0094.05.06.07.08.09.010.0VGS, Gate -to -Source Voltage (V)
Fig 12. On-Resistance Vs. Drain Current
CurrentRegulatorSameTypeasD.U.T.Fig 13. On-Resistance Vs. Gate Voltage
50KΩ12V.2µF.3µFVGSQGSD.U.T.+V-DSQGQGDVGS3mAChargeIGIDEA S , Single Pulse Avalanche Energy (mJ)VG600500IDTOP10.1A 20.7A BOTTOM24.8A Fig 14a&b. Basic Gate Charge Test circuitand Waveforms40030020015VV(BR)DSStpVDSLDRIVER100RG20VD.U.TIAS+-VDD0A255075100125150175IAStp0.01Ω°Starting T , Junction Temperature( C)JFig 15a&b. Unclamped Inductive Test circuit
and WaveformsFig 15c. Maximum Avalanche Energy
Vs. Drain Current
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IRF3707/3707S/3707L
TO-220AB Package Outline
Dimensions are shown in millimeters (inches)
2.87 (.113)2.62 (.103)10.54 (.415)10.29 (.405)3.78 (.149)3.54 (.139)- A -6.47 (.255)6.10 (.240)- B -4.69 (.185)4.20 (.165)1.32 (.052)1.22 (.048)415.24 (.600)14.84 (.584)1.15 (.045) MIN1 2 3LEADASSIGNMENTS 1 - GATE 2 - DRAIN 3 - SOURCE 4 - DRAIN14.09 (.555)13.47 (.530)4.06 (.160)3.55 (.140)3X3X1.40 (.055)1.15 (.045)0.93 (.037)0.69 (.027)3X0.55 (.022)0.46 (.018)0.36 (.014) M B A M2.54 (.100)2XNOTES:2.92 (.115)2.64 (.104) 1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 3 OUTLINE CONFORMS TO JEDEC OUTLINE TO-220AB. 2 CONTROLLING DIMENSION : INCH 4 HEATSINK & LEAD MEASUREMENTS DO NOTINCLUDEBURRS.TO-220AB Part Marking Information
EXAMPLE : THIS IS AN IRF1010 WITH ASSEMBLY LOT CODE 9B1MAINTERNATIONAL RECTIFIER LOGO ASSEMBLY LOT CODEPART NUMBERIRF101092469B 1MDATE CODE (YYWW)YY = YEARWW = WEEKwww.irf.com7
IRF3707/3707S/3707L
D2Pak Package Outline
Dimensions are shown in millimeters (inches)
10.54 (.415)10.29 (.405)1.40 (.055) MAX.- A -24.69 (.185)4.20 (.165)- B -1.32 (.052)1.22 (.048)10.16 (.400) REF.6.47 (.255)6.18 (.243)15.49 (.610)14.73 (.580)5.28 (.208)4.78 (.188)2.79 (.110)2.29 (.090)2.61 (.103)2.32 (.091)1.39 (.055)1.14 (.045)8.89 (.350) REF.1.78 (.070)1.27 (.050)1 33X1.40 (.055)1.14 (.045)5.08 (.200)3X0.93 (.037)0.69 (.027)0.25 (.010) M B A M0.55 (.022)0.46 (.018)MINIMUM RECOMMENDED FOOTPRINT11.43 (.450)NOTES: 1 DIMENSIONS AFTER SOLDER DIP. 2 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 3 CONTROLLING DIMENSION : INCH. 4 HEATSINK & LEAD DIMENSIONS DO NOT INCLUDE BURRS.LEAD ASSIGNMENTS 1 - GATE 2 - DRAIN 3 - SOURCE8.89 (.350)17.78 (.700)3.81 (.150)2.08 (.082) 2X2.54 (.100) 2XD2Pak Part Marking Information
INTERNATIONAL RECTIFIER LOGO ASSEMBLY LOT CODEPART NUMBERF530S92469B 1MDATE CODE (YYWW)YY = YEARWW = WEEK8www.irf.com
IRF3707/3707S/3707L
TO-262 Package Outline
Dimensions are shown in millimeters (inches)
TO-262 Part Marking Informationwww.irf.com9
IRF3707/3707S/3707L
D2Pak Tape & Reel Information
Dimensions are shown in millimeters (inches)
TRR1.60 (.063)1.50 (.059)4.10(.161)3.90(.153)1.60 (.063)1.50 (.059)0.368 (.0145)0.342 (.0135)FEED DIRECTION1.85 (.073)1.65 (.065)11.60(.457)11.40(.449)15.42 (.609)15.22 (.601)24.30 (.957)23.90 (.941)TRL10.90 (.429)10.70 (.421)1.75 (.069)1.25 (.049)16.10 (.634)15.90 (.626)4.72 (.136)4.52 (.178)FEED DIRECTION13.50 (.532)12.80 (.504)27.40 (1.079)23.90 (.941)4330.00(14.173) MAX.60.00 (2.362) MIN.NOTES :1. COMFORMS TO EIA-418.2. CONTROLLING DIMENSION: MILLIMETER.3. DIMENSION MEASURED @ HUB.4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.30.40 (1.197) MAX.26.40 (1.039)24.40 (.961)43Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
Pulse width ≤ 300µs; duty cycle ≤ 2%.
This is only applied to TO-220AB package
Starting TJ = 25°C, L = 0.7 mH
RG = 25Ω, IAS = 24.8 A.
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Data and specifications subject to change without notice. 8/0010www.irf.com
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