专利名称：Adhesive, adhesive member, interconnecting
substrate for semiconductor mountinghaving adhesive member, and semiconductordevice containing the same
发明人：Yuko Tanaka,Yasushi Shimada,Teiichi
Inada,Hiroyuki Kuriya,Kazunori
Yamamoto,Yasushi Kumashiro,Keiji Sumiya
申请号：US10351430申请日：20030127
公开号：US20030145949A1公开日：20030807
摘要：An adhesive which comprises (1) 100 parts by weight of an epoxy resin and ahardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymerhaving a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transitiontemperature of −10° C. or higher and a weight average molecular weight of 100,000 ormore and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive memberhaving a layer of the adhesive; an interconnecting substrate for semiconductor mountinghaving the adhesive member; and a semiconductor device containing the same.
申请人：TANAKA YUKO,SHIMADA YASUSHI,INADA TEIICHI,KURIYAHIROYUKI,YAMAMOTO KAZUNORI,KUMASHIRO YASUSHI,SUMIYA KEIJI
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