Image sensing module with improved assembly precis

专利名称：Image sensing module with improved

assembly precision

发明人：Ying-Cheng Wu,Chun-Hung Lin申请号：US11617627申请日：20061228公开号：US07626160B2公开日：20091201

专利附图：

摘要：An image sensor package () includes a base board (), a supporter (), an imagesensor (), a plurality of wires (), a main adhesive () and a cover board (). The supporterincludes a through hole and a plurality of top pads () formed around the through hole,

and the supporter is mounted on the base board and electrically connected to the baseboard. The image sensor is mounted on the base board and received in the through hole,and the image sensor includes a sensing portion () and a plurality of contacts (). The wireselectrically connect the top pads to the contacts. The main adhesive is applied on theimage sensor and surrounds the sensing portion. The cover board supported on the mainadhesive, and the cover board and the main adhesive cooperatively enclose the sensingportion of the image sensor.

申请人：Ying-Cheng Wu,Chun-Hung Lin

地址：Miao-Li Hsien TW,Miao-Li Hsien TW

国籍：TW,TW

代理人：Zhigang Ma

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