专利名称：Systems and methods for wafer alignment发明人：Yang Chao,Keith E. Ypma,Steve J. Strauch申请号：US16248500申请日：20190115公开号：US10347519B2公开日：20190709
专利附图：
摘要：Various embodiments of aligning wafers are described herein. In oneembodiment, a photolithography system aligns a wafer by averaging individual vialocations. In particular, some embodiments of the present technology determine thecenter locations of individual vias on a wafer and average them together to obtain an
average center location of the set of vias. Based on a comparison of the average centerlocation to a desired center location, the present technology adjusts the wafer position.Additionally, in some embodiments, the present technology compares wafer via patternsto a template and adjusts the position of the water based on the comparison.
申请人：Micron Technology, Inc.
地址：Boise ID US
国籍：US
代理机构：Perkins Coie LLP
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