MULTI-CHIP MODULE

专利名称：MULTI-CHIP MODULE

发明人：YAMAGUCHI, Masayoshi 2-22, Nishimachi 1-chome,SAWANO, Mitsutoshi 13-23,

Soshigaya 3-chome,HOHKI, Kazutoshi 20-6,Higashi-Toyoda 3-chome

申请号：EP94927045.8申请日：19940914公开号：EP0720232B1公开日：20070411

摘要：Bare IC chips (201 through 203) are mounted on respective areas (101 through103) of a printed wiring board (100). The outer electrode pads (105) on the peripheries ofthe board (100) are soldered to another printed wiring board (1) such as a mother board.Lead pads (107) and the outer electrode pads (105) are interconnected through a circuitpattern (109), through holes (111) and interstitial via holes (112). The circuit pattern (109)is disposed on a die bonding surface of the bare IC chips (201 and 202) for whichinsulation is not necessary. A multi-chip module is thus completed.

申请人：TOSHIBA KK

地址：JP

国籍：JP

代理机构：Zangs, Rainer E.

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