专利名称：Lead frame for a semiconductor device发明人：Yasushi Sasaki,Shogo Tani,Yoshihiro
Uchino,Kiyotaka Tomiyama,Yutaka Maeno
申请号：US09908564申请日：20010720公开号：US06541851B2公开日：20030401
专利附图：
摘要：In a semiconductor device, a lead frame is adhered to a base substrate for heatdissipation via an insulating layer, and an outward guided terminal portion is formed byperpendicularly upwardly bending an end of the lead frame after the mounting of one or
more of power semiconductor elements on the lead frame. A recessed portion is formedbeforehand in a portion of the lead frame to be bent, and it is ensured that the leadframe does not adhere to the surface of the base substrate in this recessed portion whenthe lead frame is adhered to the base substrate via the insulating layer before thebending of the lead frame. By virtue of this structure, manufacturing is simplified andmanufacturing costs are reduced.
申请人：HITACHI, LTD.
代理机构：Antonelli, Terry, Stout & Kraus, LLP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容