Flip-chip package substrate with a high-density la

专利名称：Flip-chip package substrate with a high-density layout

发明人：Chih-Pin Hung,Pao-Nan Li,Hsueh-Te

Wang,Yun-Hsiang Tien

申请号：US11123204申请日：20050506

公开号：US20050248037A1公开日：20051110

专利附图：

摘要：A flip-chip package substrate with a high-density layout. A number of pads anda number of traces are formed on an upper surface of the substrate. At least a pad has a

short axis and a vertical long axis which are perpendicular to each other. The distancebetween the elongated pad and the pad adjacent thereto is not smaller than two thirdsof the length of the short axis, so that at least two of the traces can pass between theelongated pad and the pad adjacent thereto.

申请人：Chih-Pin Hung,Pao-Nan Li,Hsueh-Te Wang,Yun-Hsiang Tien

地址：Kaohsiung TW,Pingtung TW,Kaohsiung TW,Kaohsiung TW

国籍：TW,TW,TW,TW

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