CR05AS-8
Thyristor
Low Power Use
REJ03G0543-0100
Rev.1.00 Mar.01.2005
Features
• IT (AV) : 0.5 A • VDRM : 400 V • IGT : 100 µA
• Non-Insulated Type • Planar Passivation Type
Outline
PLZZ0004CA-A(Package name: UPAK)1232, 44311. Cathode2. Anode3. Gate4. Anode
Applications
Solid state relay, strobe flasher, igniter, and hybrid IC
Maximum Ratings
Voltage class
Parameter Symbol Unit
8 (Mark CD)
Repetitive peak reverse voltage VRRM 400 V Non-repetitive peak reverse voltage VRSM 500 V DC reverse voltage VR (DC) 320 V Repetitive peak off-state voltageNote1 VDRM 400 V DC off-state voltageNote1 VD (DC) 320 V
Rev.1.00, Mar.01.2005, page 1 of 7
元器件交易网www.cecb2b.com
CR05AS-8
Parameter Symbol Ratings Unit Conditions
RMS on-state current IT (RMS) 0.79 A Average on-state current IT (AV) 0.5 A Commercial frequency, sine half wave
Note2
180° conduction, Ta = 57°C
Surge on-state current ITSM 10 A 60Hz sine half wave 1 full cycle,
peak value, non-repetitive
222It for fusing It 0.4 As Value corresponding to 1 cycle of half
wave 60Hz, surge on-state current
Peak gate power dissipation PGM 0.1 W Average gate power dissipation PG (AV) 0.01 W Peak gate forward voltage VFGM 6 V Peak gate reverse voltage VRGM 6 V Peak gate forward current IFGM 0.1 A Junction temperature Tj – 40 to +125 °C Storage temperature Tstg – 40 to +125 °C Mass — 50 mg Typical value Notes: 1. With gate to cathode resistance RGK = 1 kΩ.
Electrical Characteristics
Rated value
Parameter Symbol Unit Test conditions Min. Typ. Max. Repetitive peak reverse current IRRM — — 0.1 mA Tj = 125°C, VRRM applied Repetitive peak off-state current IDRM — — 0.1 mA Tj = 125°C, VDRM applied,
RGK = 1 kΩ
On-state voltage VTM — — 1.9 V Ta = 25°C, ITM = 1.5 A,
instantaneous value
Gate trigger voltage VGT — — 0.8 V Tj = 25°C, VD = 6 V,
Note4
IT = 0.1 A
Gate non-trigger voltage VGD 0.2 — — V Tj = 125°C, VD = 1/2 VDRM,
RGK = 1 kΩ
Note3Gate trigger current IGT 20 — 100 µA Tj = 25°C, VD = 6 V,
Note4
IT = 0.1 A
Holding current IH — — 3 mA Tj = 25°C, VD = 12 V,
RGK = 1 kΩ
Thermal resistance Rth (j-a) — — 70 °C/W Junction to ambientNote2 Notes: 2. Soldering with ceramic plate (25 mm × 25 mm × t0.7 mm). 3. If special values of IGT are required, choose item E from those listed in the table below if possible.
Item B E IGT (µA) 20 to 50 20 to 100 The above values do not include the current flowing through the 1 kΩ resistance between the gate and cathode.
4. IGT, VGT measurement circuit.
A1IGS3VDCA3RGK11kΩSwitchIGTA22V1VGTTUT6VDC60ΩSwitch 1 : IGT measurementSwitch 2 : VGT measurement(Inner resistance of voltage meter is about 1kΩ)
Rev.1.00, Mar.01.2005, page 2 of 7
元器件交易网www.cecb2b.com
CR05AS-8
Performance Curves
Maximum On-State Characteristics1027Ta = 25°C5321017532100753210–101234510Rated Surge On-State CurrentSurge On-State Current (A)98765432101002345710123457102On-State Current (A)On-State Voltage (V)Conduction Time (Cycles at 60Hz)Gate Trigger Current vs. Junction Temperature103753210275321017532100–60–40–200204060801001201401027532753275327532× 100 (%)Gate CharacteristicsTypical ExampleGate Voltage (V)101PG(AV) = 0.01WVGT = 0.8VIGT = 100µA(Tj = 25°C)VGD = 0.2VIFGM = 0.1A10010–110–210–2235710–1235710023571012357102Gate Current (mA)Gate Trigger Current (Tj = t°C)Gate Trigger Current (Tj = 25°C)VFGM = 6VPGM = 0.1WJunction Temperature (°C)Gate Trigger Voltage vs. Junction Temperature1.00.9Maximum Transient Thermal ImpedanceCharacteristics (Junction to ambient)0.80.70.60.50.40.30.20.1DistributionTypical ExampleTransient Thermal Impedance (°C/W)Gate Trigger Voltage (V)100235710123571022357103103725×25×t0.75Aluminum Board321027532101753210010–3235710–2235710–123571000–40–20020406080100120140160Junction Temperature (°C)Time (s)
Rev.1.00, Mar.01.2005, page 3 of 7
元器件交易网www.cecb2b.com
CR05AS-8
Allowable Ambient Temperature vs.Average On-State Current(Single-Phase Half Wave)160Maximum Average Power Dissipation(Single-Phase Half Wave)1.5Average Power Dissipation (W)Ambient Temperature (°C)θ = 30°60°90°120°180°1.025×25×t0.7140Aluminum Board12010080604020000.2θ360°Resistive,inductive loadsNatural convection0.5θ360°Resistive,inductive loads00.10.20.30.40.50.60.70.8θ = 30°60°90°180°120°00.40.60.8Average On-State Current (A)Maximum Average Power Dissipation(Single-Phase Full Wave)160Average On-State Current (A)Allowable Ambient Temperature vs.Average On-State Current(Single-Phase Full Wave)25×25×t0.7140Aluminum Board1201008060402000Average Power Dissipation (W)1.5Ambient Temperature (°C)90°θ = 30°60°120°180°θθ360°Resistive loadsNatural convection1.00.5θθ360°060°θ = 30°0.20.4120°90°0.6180°0.8Resistive loads00.10.20.30.40.50.60.70.8Average On-State Current (A)Average On-State Current (A)Allowable Ambient Temperature vs.Average On-State Current(Rectangular Wave)160Maximum Average Power Dissipation(Rectangular Wave)Average Power Dissipation (W)1.5Ambient Temperature (°C)90°180°θ = 30°60°120°270°DC25×25×t0.7140Aluminum Board12010080604020000.2θ360°1.0Resistive, inductive loadsNatural convection0.5θ360°DCθ = 30°60°120°90°0.4270°180°0.60.800Resistive,inductive loads0.10.20.30.40.50.60.70.8Average On-State Current (A)Average On-State Current (A)
Rev.1.00, Mar.01.2005, page 4 of 7
元器件交易网www.cecb2b.com
CR05AS-8
Breakover Voltage vs.Junction TemperatureBreakover Voltage vs.Gate to Cathode Resistance12010080604020010–1235710023571012357102× 100 (%)16014012010080604020× 100 (%)Typical ExampleTypical ExampleTj = 125°CRGK = 1kΩ0–40–20020406080100120140160Breakover Voltage (RGK = rkΩ)Breakover Voltage (RGK = 1kΩ)Breakover Voltage (Tj = t°C)Breakover Voltage (Tj = 25°C)Junction Temperature (°C)Breakover Voltage vs.Rate of Rise of Off-State Voltage120100806040102753210175321007532Gate to Cathode Resistance (kΩ)× 100 (%)Holding Current vs.Junction TemperatureTj = 25°CIH (25°C) = 1mAIGT(25°C) = 25µABreakover Voltage (dv/dt = vV/µs)Breakover Voltage (dv/dt = 1V/µs)Holding Current (mA)DistributionTypical Example# 2# 1Typical Example20 # 1 IGT(25°C = 10µA) # 2 IGT(25°C = 66µA) Tj = 125°C, RGK = 1kΩ 010023571012357102235710310–1–60–40–20020406080100120140Rate of Rise of Off-State Voltage (V/µs)Junction Temperature (°C)500400# 1300Repetitive Peak Reverse Voltage (Tj = t°C)Repetitive Peak Reverse Voltage (Tj = 25°C)× 100 (%)Holding Current vs.Gate to Cathode ResistanceRepetitive Peak Reverse Voltage vs.Junction Temperature160140120100806040200–40–20020406080100120140160× 100 (%)Holding Current (RGK = rkΩ)Holding Current (RGK = 1kΩ)Typical ExampleIGT(25°C)IH(1kΩ)13µA1.6mA# 1 59µA1.8mA# 2Typical Example# 2200100Tj = 25°C010–1235710023571012357102Gate to Cathode Resistance (kΩ)Junction Temperature (°C)
Rev.1.00, Mar.01.2005, page 5 of 7
元器件交易网www.cecb2b.com
CR05AS-8
Gate Trigger Current vs.Gate Current Pulse Width1037543210275432× 100 (%)# 1# 2Typical ExampleIGT(25°C)# 110µA# 266µAGate Trigger Current (tw)Gate Trigger Current (DC)Tj = 25°C1011002345710123457102Gate Current Pulse Width (µs)
Rev.1.00, Mar.01.2005, page 6 of 7
元器件交易网www.cecb2b.com
CR05AS-8
Package Dimensions
JEITA Package CodeSC-62RENESAS CodePLZZ0004CA-APackage NameUPAK / UPAKVMASS[Typ.]0.050gUnit: mm4.5 ± 0.11.51.53.00.8 Min0.44 Max(0.4)0.53 Max0.48 Max(2.5)φ12.5 ± 0.14.25 Max0.41.8 Max1.5 ± 0.10.44 Max(1.5)(0.2)
Order Code
Lead form
Standard packing
Quantity
Standard order code
Standard order code example CR05AS-8-ET14
Surface-mounted type Taping 4000Type name – ET +Direction (1 or 2) + 4 Note : Please confirm the specification about the shipping in detail.
Rev.1.00, Mar.01.2005, page 7 of 7
元器件交易网www.cecb2b.com
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan1.Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that troublemay occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits,(ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.Notes regarding these materials1.These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer'sapplication; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.2.Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.3.All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time ofpublication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It istherefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest productinformation before purchasing a product listed herein.The information described here may contain technical inaccuracies or typographical errors.Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductorhome page (http://www.renesas.com).4.When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure toevaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumesno responsibility for any damage, liability or other loss resulting from the information contained herein.5.Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human lifeis potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of aproduct contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeateruse.6.The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.7.If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government andcannot be imported into a country other than the approved destination.Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.8.Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.Keep safety first in your circuit designs!RENESAS SALES OFFICESRefer to \"http://www.renesas.com/en/network\" for the latest and detailed information.http://www.renesas.comRenesas Technology America, Inc.450 Holger Way, San Jose, CA 95134-1368, U.S.ATel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd.10th Floor, No.99, Fushing North Road, Taipei, TaiwanTel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd.Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, ChinaTel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd.1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0
因篇幅问题不能全部显示,请点此查看更多更全内容