专利名称：APPARATUS FOR IMPROVING GROUNDING
FOR AN ELECTRICAL COMPONENT ANDMETHOD OF MAKING SAME
发明人：Victor Taracila,Fraser John Laing
Robb,Vijayanand Alagappan,Miguel AngelNavarro, II,Peter Asuzu
申请号：US13195707申请日：20110801
公开号：US20130033835A1公开日：20130207
专利附图：
摘要：A multi-layer cradle comprises a first layer comprising first and second contactpads configured to be electrically coupled to a signal input and a signal output of theelectronic component, respectively. The first layer also comprises a first ground planeconfigured to be electrically coupled to a ground of the electronic component and a firstfence positioned about the first ground plane. The first ground plane is positioned atleast between the first and second contact pads. A second layer comprising a secondground plane is also included. The cradle further comprises a first dielectric materialpositioned between the first and second layers, a ground plane via extending through thefirst dielectric material and electrically coupled to the first and second ground planes,and a plurality of fence vias extending through the first dielectric material and electricallycoupled to the first fence and to second ground plane.
申请人：Victor Taracila,Fraser John Laing Robb,Vijayanand Alagappan,Miguel AngelNavarro, II,Peter Asuzu
地址：Beachwood OH US,Aurora OH US,Streetsboro OH US,Sheffield Village OHUS,Schenectady NY US
国籍：US,US,US,US,US
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