专利名称：Manufacturing method of electrical circuit
boards
发明人：Martin, Johann申请号：EP87202440申请日：19871207公开号：EP0271163A3公开日：19881228
摘要：The invention relates to a manufacturing method for electrical circuit boardswhich consist of a board-shaped plastic carrier and flat conductor tracks which areconnected thereto and form a circuit pattern, which boards have contact points forcomponents which make contact with them. The circuit pattern is cut from a copper platein a cutting tool using cutting stamps and pressing pads, and is moulded into plastic, theplastic forming the board-shaped carrier. The copper plate is cut into only in a partialsection while maintaining a structure which is still coherent consisting of the subsequentconductor tracks of the circuit pattern and empty tracks located between them. Thisstructure of the copper plate is inserted in a plastic injection mould with spacers in thehollow space of the mould, the spacers pressing the conductor and empty tracks apart inthe hollow space of the mould into at least two planes offset with respect to oneanother, in which the tracks are then held firmly by the spacers during the plasticinjection process.
申请人：Philips Patentverwaltung GmbH,N.V. Philips' Gloeilampenfabrieken
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